24-4508 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Mounting Type	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Termination	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Material Flammability Rating	Number of Positions or Pins (Grid)	Current Rating (Amps)	Housing Material	Contact Finish - Post	Type	Type	Type	Termination Post Length	Termination Post Length
Aries Electronics 24-4508-21	30 Áin	0.76 Ám	10 çin	0.25 çm	Open Frame	Through Hole	2.54 mm	0.1 in	-55 °C	125 °C	Gold	Wire Wrap	Brass	0.36 in	9.14 mm	0.1 in	2.54 mm	Beryllium Copper	UL94 V-0	24	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.4 in	10.16 mm	DIP
Aries Electronics 24-4508-30	30 Áin	0.76 Ám	200 µin	5.08 µm	Open Frame	Through Hole	2.54 mm	0.1 in	-55 °C	105 ░C	Gold	Wire Wrap	Brass			0.1 in	2.54 mm	Beryllium Copper	UL94 V-0	24	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	0.4 in	10.16 mm	DIP	0.5 in	12.7 mm