612-93 Series
Manufacturer: Mill-Max Manufacturing Corp.
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⌘K
SKT CARRIER SOLDRTL
| Part | Contact Finish Thickness - Post | Contact Finish - Mating | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Housing Material | Pitch - Post | Features | Contact Finish Thickness - Mating | Pitch - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Contact Material - Mating | Row Spacing | Type | Contact Material - Post | Termination | Contact Finish - Post | Contact Resistance | Termination Post Length | Current Rating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Mill-Max Manufacturing Corp. | 200 µin | Gold | 25 | 2 | 50 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.183 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 24 | 2 | 48 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.273 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 26 | 2 | 52 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.273 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 12 | 2 | 24 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.273 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 16 | 2 | 32 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.183 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 16 | 2 | 32 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.4 in | 0.4" (10.16mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 0.124 in | 3 A | ||
Mill-Max Manufacturing Corp. | 200 µin | Gold | 8 | 2 | 16 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.183 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 10 | 2 | 20 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 0.124 in | 3 A | ||
Mill-Max Manufacturing Corp. | 200 µin | Gold | 4 | 2 | 8 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 10 mOhm | 0.183 in | 3 A | UL94 V-0 |
Mill-Max Manufacturing Corp. | 200 µin | Gold | 8 | 2 | 16 | PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Carrier Open Frame | 30 µin | 0.1 in | 125 °C | -55 °C | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass Alloy | Solder | Tin-Lead | 0.124 in | 3 A |