Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Fin Height [z] | Fin Height [z] | Thermal Resistance @ Natural | Width | Width [x] | Material Finish | Type | Attachment Method | Package Cooled | Shape | Material | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Length [x] | Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | 50.8 mm | 2 in | 4.5 °C/W | 25.4 mm | 1 in | Black Anodized | Board Level Vertical | Clip PC Pin | TO-220 | Rectangular Fins | Aluminum | 6 W | 1 °C/W | 1.65 in | 41.91 mm |