20-1508 Series

Catalog

20P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Material Flammability Rating	Type	Type	Type	Contact Material - Post [custom]	Mounting Type	Termination	Termination Post Length [x]	Termination Post Length [x]	Current Rating (Amps)	Contact Finish - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Features	Housing Material	Contact Finish - Post
Aries Electronics 20-1508-20	200 µin	5.08 µm	Beryllium Copper	20	10 çin	0.25 çm	0.1 in	2.54 mm	2.54 mm	0.1 in	UL94 V-0	DIP	5.08 mm	0.2 in	Brass	Through Hole	Wire Wrap	0.36 in	9.14 mm	3 A	Gold	105 ░C	-55 °C	Closed Frame	Polyamide (PA46) Nylon 4/6	Tin
Aries Electronics 20-1508-21	10 çin	0.25 çm	Beryllium Copper	20	10 çin	0.25 çm	0.1 in	2.54 mm	2.54 mm	0.1 in	UL94 V-0	DIP	5.08 mm	0.2 in	Brass	Through Hole	Wire Wrap	0.36 in	9.14 mm	3 A	Gold	125 °C	-55 °C	Closed Frame	Polyamide (PA46) Nylon 4/6	Gold