20-1508 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Current Rating	Material Flammability Rating	Termination Post Length	Row Spacing	Type	Features	Contact Finish - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Termination	Contact Material - Post	Contact Finish Thickness - Mating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Pitch - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Housing Material	Pitch - Mating	Contact Finish - Post
Aries Electronics 20-1508-20	3 A	UL94 V-0	0.36 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	Closed Frame	Gold	-55 °C	105 °C	Wire Wrap	Brass	10 µin	2	10	20	0.1 in	200 µin	Beryllium Copper	Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	Tin
Aries Electronics 20-1508-31	3 A	UL94 V-0	0.5 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	Closed Frame	Gold	-55 °C	125 °C	Wire Wrap	Brass	10 µin	2	10	20	0.1 in	10 µin	Beryllium Copper	Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	Gold
Aries Electronics 20-1508-30	3 A	UL94 V-0	0.5 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	Closed Frame	Gold	-55 °C	105 °C	Wire Wrap	Brass	10 µin	2	10	20	0.1 in	200 µin	Beryllium Copper	Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	Tin
Aries Electronics 20-1508-21	3 A	UL94 V-0	0.36 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	Closed Frame	Gold	-55 °C	125 °C	Wire Wrap	Brass	10 µin	2	10	20	0.1 in	10 µin	Beryllium Copper	Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	Gold