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18P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Type | Type | Type | Contact Material - Mating | Termination | Contact Material - Post [custom] | Mounting Type | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.3 " | 7.62 mm | DIP | Beryllium Copper | Solder | Brass | Through Hole | Closed Frame Elevated | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | 10 çin | 0.25 çm | Gold | Gold | UL94 V-0 | 2.54 mm | 0.1 in | 3.56 mm | 0.14 in | 0.1 in | 2.54 mm | 18 | 105 ░C | -55 °C |