HEATSINK CPU W/ADHESIVE 1.01"SQ
| Part | Material Finish | Width [x] | Width [x] | Thermal Resistance @ Forced Air Flow | Fin Height | Fin Height | Material | Package Cooled | Type | Attachment Method | Length | Length | Thermal Resistance @ Natural | Shape | Shelf Life |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products BDN10-5CB/A01 | Black Anodized | 25.65 mm | 1.01 in | 6.3 °C/W, 400 LFM | 0.555 in | 14.1 mm | Aluminum | ASIC, BGA, CPU, LGA | Top Mount | Thermal Tape, Adhesive (Included) | 25.65 mm | 1.01 " | 20.8 °C/W | Pin Fins, Square | 24 Months |
CTS Thermal Management Products BDN10-3CB/A01 | Black Anodized | 25.65 mm | 1.01 in | 8 °C/W | 0.355 in | 9.02 mm | Aluminum | ASIC, BGA, CPU, LGA | Top Mount | Thermal Tape, Adhesive (Included) | 25.65 mm | 1.01 " | 26.4 °C/W | Pin Fins, Square | 24 Months |