48-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS

Part	Features	Material Flammability Rating	Termination	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Number of Positions or Pins (Grid)	Housing Material	Contact Material - Post	Contact Finish - Post	Contact Finish - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 48-3552-18	Closed Frame	UL94 V-0	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm	-55 °C	250 °C	1 A	48	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	Nickel Boron	Nickel Boron	Through Hole	1.27 µm	50 µin	Beryllium Nickel	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	1.27 µm	50 µin
Aries Electronics 48-3552-11	Closed Frame	UL94 V-0	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm			1 A	48	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Gold	Through Hole			Beryllium Copper	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)
Aries Electronics 48-3552-16	Closed Frame	UL94 V-0	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm			1 A	48	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Nickel Boron	Nickel Boron	Through Hole	1.27 µm	50 µin	Beryllium Copper	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	1.27 µm	50 µin
Aries Electronics 48-3552-10	Closed Frame	UL94 V-0	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm			1 A	48	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Tin		Through Hole	5.08 µm	200 µin	Beryllium Copper	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	5.08 µm	200 µin