ESS-122 Series

Catalog

CONN SOCKET 22POS 0.1 TIN PCB

Part	Number of Rows	Connector Type	Mounting Type	Insulation Color	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions	Pitch - Mating	Material Flammability Rating	Contact Length - Post	Contact Finish - Post	Contact Finish - Mating	Style	Fastening Type	Contact Type	Insulation Height	Number of Positions Loaded	Termination	Insulation Material	Contact Material	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. ESS-122-TT-05	1	Elevated Socket	Through Hole	Black	125 °C	-55 °C	22	0.1 in	UL94 V-0	0.173 in	Tin	Tin	Board	Push-Pull	Female Socket	0.5 in	All	Solder	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESS-122-TT-03	1	Elevated Socket	Through Hole	Black	125 °C	-55 °C	22	0.1 in	UL94 V-0	0.123 in	Tin	Tin	Board	Push-Pull	Female Socket	0.3 in	All	Solder	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESS-122-T-23	1	Elevated Socket	Through Hole	Black	125 °C	-55 °C	22	0.1 in	UL94 V-0	0.123 in	Tin	Gold	Board	Push-Pull	Female Socket	0.3 in	All	Solder	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin
Samtec Inc. ESS-122-G-05	1	Elevated Socket	Through Hole	Black	125 °C	-55 °C	22	0.1 in	UL94 V-0	0.173 in	Gold	Gold	Board	Push-Pull	Female Socket	0.5 in	All	Solder	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin
Samtec Inc. ESS-122-G-04	1	Elevated Socket	Through Hole	Black	125 °C	-55 °C	22	0.1 in	UL94 V-0	0.123 in	Gold	Gold	Board	Push-Pull	Female Socket	0.4 in	All	Solder	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin
Samtec Inc. ESS-122-T-26	1	Elevated Socket	Through Hole	Black	125 °C	-55 °C	22	0.1 in	UL94 V-0	0.223 in	Tin	Gold	Board	Push-Pull	Female Socket	0.3 in	All	Solder	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin