SOCKET STRIPS
| Part | Mounting Type | Insulation Material | Contact Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Rows | Contact Finish - Post | Termination | Insulation Height | Insulation Height | Contact Type | Contact Length - Post [x] | Contact Length - Post [x] | Fastening Type | Insulation Color | Pitch - Mating | Pitch - Mating | Number of Positions | Contact Shape | Number of Positions Loaded | Connector Type | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | 3.18 mm | 0.125 in | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | ||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | 3.18 mm | 0.125 in | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | ||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | 0.173 in | 4.4 mm | ||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Gold | Solder | 0.1 in | 2.54 mm | Female Socket | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | 0.36 in | 9.14 mm | 10 çin | 0.25 çm | ||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | 3.18 mm | 0.125 in | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | |||||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | 0.51 in | 12.95 mm | ||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Gold | Solder | 0.1 in | 2.54 mm | Female Socket | 6.6 mm | 0.26 in | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | 10 çin | 0.25 çm | ||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 10 çin | 0.25 çm | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | 3.18 mm | 0.125 in | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | ||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | 3.18 mm | 0.125 in | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle | ||||
Samtec Inc. | Through Hole | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | Gold | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 | Tin | Solder | 0.1 in | 2.54 mm | Female Socket | Push-Pull | Black | 0.1 in | 2.54 mm | 30 | Circular | All | Receptacle |