TMM-117 Series
Manufacturer: Samtec Inc.
Beta
⌘K
2MM TERMINAL STRIP
| Part | Contact Material | Contact Length - Mating | Material Flammability Rating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Mating | Number of Rows | Termination | Contact Finish - Post | Row Spacing - Mating | Style | Number of Positions Loaded | Insulation Height | Features | Connector Type | Contact Type | Shrouding | Contact Shape | Number of Positions | Insulation Color | Current Rating (Per Contact) | Insulation Material | Contact Finish - Mating | Pitch - Mating | Fastening Type | Mounting Type | Contact Finish Thickness - Post | Contact Length - Post | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Phosphor Bronze | 0.065 in | UL94 V-0 | 125 °C | -55 °C | 20 Ąin | 2 | Solder | Gold | 0.079 in | Board Board or Cable | All | 0.059 in | Pick and Place | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Surface Mount | 3 µin | ||
 Samtec Inc. | Phosphor Bronze | 0.157 in | 125 °C | -55 °C | 20 Ąin | 1 | Solder | Gold | Board Board or Cable | All | 0.059 in | Header | Male Pin | Unshrouded | Square | 17 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Through Hole | 3 µin | 0.106 in | 0.323 in | |||
 Samtec Inc. | Phosphor Bronze | 0.126 in | UL94 V-0 | 125 °C | -55 °C | 3 µin | 2 | Solder | Tin | 0.079 in | Board Board or Cable | All | 0.059 in | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Surface Mount | ||||
Samtec Inc. | Phosphor Bronze | 0.126 in | UL94 V-0 | 125 °C | -55 °C | 30 µin | 2 | Solder | Tin | 0.079 in | Board Board or Cable | All | 0.059 in | Pick and Place | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Surface Mount | |||
 Samtec Inc. | Phosphor Bronze | 0.126 in | 125 °C | -55 °C | 10 µin | 1 | Solder | Tin | Board Board or Cable | All | 0.059 in | Header | Male Pin | Unshrouded | Square | 17 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Through Hole | 0.138 in | 0.323 in | ||||
 Samtec Inc. | Phosphor Bronze | 0.075 in | 125 °C | -55 °C | 20 Ąin | 2 | Solder | Gold | 0.079 in | Board Board or Cable | All | 0.059 in | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Through Hole | 3 µin | 0.09 in | 0.224 in | ||
 Samtec Inc. | Phosphor Bronze | 0.168 in | UL94 V-0 | 125 °C | -55 °C | 10 µin | 2 | Solder | Tin | 0.079 in | Board Board or Cable | All | 0.059 in | Board Guide | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Surface Mount | |||
Samtec Inc. | Phosphor Bronze | 0.126 in | UL94 V-0 | 125 °C | -55 °C | 3 µin | 2 | Solder | Tin | 0.079 in | Board Board or Cable | All | 0.059 in | Board Guide | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Surface Mount | |||
 Samtec Inc. | Phosphor Bronze | 0.157 in | 125 °C | -55 °C | 20 Ąin | 2 | Solder | Gold | 0.079 in | Board Board or Cable | All | 0.059 in | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Through Hole | 3 µin | 0.106 in | 0.323 in | ||
Samtec Inc. | Phosphor Bronze | 0.126 in | UL94 V-0 | 125 °C | -55 °C | 3 µin | 2 | Solder | Tin | 0.079 in | Board Board or Cable | All | 0.059 in | Pick and Place | Header | Male Pin | Unshrouded | Square | 34 | Black | 3.2 A | Liquid Crystal Polymer (LCP) | Gold | 0.079 in | Push-Pull | Surface Mount |