612-13 Series

Manufacturer: Mill-Max Manufacturing Corp.

Catalog

SOCKET CARRIER SLDRTL .600 36POS

Part	Contact Finish - Post	Contact Finish Thickness - Mating	Termination	Row Spacing	Type	Features	Pitch - Post	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Material - Post	Pitch - Mating	Mounting Type	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Housing Material	Contact Material - Mating	Termination Post Length	Current Rating
Mill-Max Manufacturing Corp. 612-13-636-41-001000	Gold	30 µin	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	18	36	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-652-41-001000	Gold	30 µin	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	26	52	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-648-41-001000	Gold	30 µin	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	24	48	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-952-41-001000	Gold	30 µin	Solder	0.9 in	0.9" (22.86mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	26	52	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-318-41-001000	Gold	30 µin	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	9	18	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-328-41-001000	Gold	30 µin	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	14	28	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-624-41-001000	Gold	30 µin	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	12	24	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-628-41-001000	Gold	30 µin	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	14	28	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-422-41-001000	Gold	30 µin	Solder	0.4 in	0.4" (10.16mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	11	22	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A
Mill-Max Manufacturing Corp. 612-13-308-41-001000	Gold	30 µin	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP	Carrier Open Frame	0.1 in	Gold	125 °C	-55 °C	10 µin	Brass Alloy	0.1 in	Through Hole	2	4	8	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Beryllium Copper	0.124 in	3 A