32-C212 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Contact Material - Mating	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Housing Material	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Finish - Mating	Termination Post Length	Termination Post Length	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Features	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 32-C212-30	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	105 ░C	-55 °C	Through Hole	Wire Wrap	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	0.04 in	1.02 mm	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Brass	Closed Frame	2 x 16	32
Aries Electronics 32-C212-00	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	105 ░C	-55 °C	Surface Mount	Solder	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	0.04 in	1.02 mm	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Brass	Closed Frame	2 x 16	32
Aries Electronics 32-C212-10	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	105 ░C	-55 °C	Through Hole	Solder	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	0.125 in	3.18 mm	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Brass	Closed Frame	2 x 16	32
Aries Electronics 32-C212-31	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	125 °C	-55 °C	Through Hole	Wire Wrap	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	0.04 in	1.02 mm	Gold	2.54 mm	0.1 in	10 çin	0.25 çm	Brass	Closed Frame	2 x 16	32