16-C280 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Current Rating | Contact Finish - Post | Contact Material - Mating | Row Spacing | Type | Mounting Type | Housing Material | Features | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Mating | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Termination | Contact Material - Post | Pitch - Mating | Contact Finish Thickness - Post | Pitch - Post | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.125 in | 3 A | Gold | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 125 °C | -55 °C | Gold | 2 | 16 | 8 | Solder | Brass | 0.1 in | 10 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | Gold | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 125 °C | -55 °C | Gold | 2 | 16 | 8 | Wire Wrap | Brass | 0.1 in | 10 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | Tin | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Surface Mount | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 105 °C | -55 °C | Gold | 2 | 16 | 8 | Solder | Brass | 0.1 in | 200 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | Tin | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 105 °C | -55 °C | Gold | 2 | 16 | 8 | Wire Wrap | Brass | 0.1 in | 200 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | Tin | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 105 °C | -55 °C | Gold | 2 | 16 | 8 | Wire Wrap | Brass | 0.1 in | 200 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.125 in | 3 A | Gold | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 125 °C | -55 °C | Gold | 2 | 16 | 8 | Solder | Brass | 0.1 in | 10 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | Gold | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 125 °C | -55 °C | Gold | 2 | 16 | 8 | Wire Wrap | Brass | 0.1 in | 10 µin | 0.1 in | 10 µin |
Aries Electronics | UL94 V-0 | 0.125 in | 3 A | Tin | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Glass Filled Nylon 4/6 PA46 Polyamide | Closed Frame | 105 °C | -55 °C | Gold | 2 | 16 | 8 | Solder | Brass | 0.1 in | 200 µin | 0.1 in | 10 µin |