18-0513 Series

Catalog

CONN SOCKET SIP 18POS GOLD

Part	Current Rating (Amps)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Housing Material	Type	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish - Post	Contact Finish - Mating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Mounting Type	Termination Post Length	Termination Post Length	Termination
Aries Electronics 18-0513-11H	3 A	18	1 x 18	10 çin	0.25 çm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	0.1 in	2.54 mm	UL94 V-0	Gold	Gold	Beryllium Copper	10 çin	0.25 çm	Brass	Through Hole	3.18 mm	0.125 in	Solder
Aries Electronics 18-0513-10	3 A	18	1 x 18	200 µin	5.08 µm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	0.1 in	2.54 mm	UL94 V-0	Tin	Gold	Beryllium Copper	10 çin	0.25 çm	Brass	Through Hole	3.18 mm	0.125 in	Solder
Aries Electronics 18-0513-10T	3 A	18	1 x 18	200 µin	5.08 µm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	0.1 in	2.54 mm	UL94 V-0	Tin	Gold	Beryllium Copper	10 çin	0.25 çm	Brass	Through Hole	3.18 mm	0.125 in	Solder
Aries Electronics 18-0513-10H	3 A	18	1 x 18	200 µin	5.08 µm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	0.1 in	2.54 mm	UL94 V-0	Tin	Gold	Beryllium Copper	10 çin	0.25 çm	Brass	Through Hole	3.18 mm	0.125 in	Solder
Aries Electronics 18-0513-11	3 A	18	1 x 18	10 çin	0.25 çm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	0.1 in	2.54 mm	UL94 V-0	Gold	Gold	Beryllium Copper	10 çin	0.25 çm	Brass	Through Hole	3.18 mm	0.125 in	Solder