40-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Current Rating (Amps)	Contact Material - Mating	Features	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Mounting Type	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Contact Finish - Post	Housing Material	Contact Material - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating
Aries Electronics 40-6571-10	2.54 mm	0.1 in	200 µin	5.08 µm	UL94 V-0	1 A	Beryllium Copper	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	5.08 µm	200 µin	Solder	Through Hole	40	20	2	0.11 in	2.78 mm	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 in	2.54 mm
Aries Electronics 40-6571-11	2.54 mm	0.1 in	10 çin	0.25 çm	UL94 V-0	1 A	Beryllium Copper	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.25 çm	10 çin	Solder	Through Hole	40	20	2	0.11 in	2.78 mm	Gold	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 in	2.54 mm	Gold
Aries Electronics 40-6571-16	2.54 mm	0.1 in	50 µin	1.27 µm	UL94 V-0	1 A	Beryllium Nickel	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin	Solder	Through Hole	40	20	2	0.11 in	2.78 mm	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel	0.1 in	2.54 mm	Nickel Boron