14-0513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 14POS GOLD
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Number of Positions or Pins (Grid) | Grid Rows | Grid Columns | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Mounting Type | Contact Finish - Mating | Contact Material - Mating | Type | Contact Finish - Post | Pitch - Post | Contact Finish Thickness - Post | Termination | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3 A | UL94 V-0 | 14 | 1 | 14 | 0.1 in | 10 µin | Brass | Through Hole | Gold | Beryllium Copper | SIP | Tin | 0.1 in | 200 µin | Solder | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.125 in | 3 A | UL94 V-0 | 14 | 1 | 14 | 0.1 in | 10 µin | Brass | Through Hole | Gold | Beryllium Copper | SIP | Tin | 0.1 in | 200 µin | Solder | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.125 in | 3 A | UL94 V-0 | 14 | 1 | 14 | 0.1 in | 10 µin | Brass | Through Hole | Gold | Beryllium Copper | SIP | Tin | 0.1 in | 200 µin | Solder | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.125 in | 3 A | UL94 V-0 | 14 | 1 | 14 | 0.1 in | 10 µin | Brass | Through Hole | Gold | Beryllium Copper | SIP | Gold | 0.1 in | 10 µin | Solder | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.125 in | 3 A | UL94 V-0 | 14 | 1 | 14 | 0.1 in | 10 µin | Brass | Through Hole | Gold | Beryllium Copper | SIP | Gold | 0.1 in | 10 µin | Solder | Glass Filled Nylon 4/6 PA46 Polyamide |