90098 Series

Catalog

CONN HEADER SMD 40POS 1.27MM

Part	Insulation Height	Operating Temperature (Min)	Operating Temperature (Max)	Contact Type	Contact Finish - Post	Insulation Material	Contact Finish - Mating	Fastening Type	Pitch - Mating	Style	Termination	Number of Positions Loaded	Number of Positions	Features	Contact Finish Thickness - Mating	Connector Type	Mounting Type	Shrouding	Insulation Color	Contact Length - Mating	Contact Shape	Material Flammability Rating	Number of Rows	Row Spacing - Mating	Mated Stacking Height	Contact Finish Thickness - Post
Amphenol ICC (FCI) 90098-120TRLF	0.298 in	-55 °C	130 °C	Male Pin	Tin	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	40	Board Guide Pick and Place	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-120	0.298 in	-55 °C	130 °C	Male Pin	Tin-Lead	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	40	Board Guide	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-150LF	0.298 in	-55 °C	130 °C	Male Pin	Tin	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	100	Board Guide	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-125TRLF	0.298 in	-55 °C	130 °C	Male Pin	Tin	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	50	Board Guide Pick and Place	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-120LF	0.298 in	-55 °C	130 °C	Male Pin	Tin	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	40	Board Guide	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-105TRLF	0.298 in	-55 °C	130 °C	Male Pin	Tin	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	10	Board Guide Pick and Place	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-110	0.298 in	-55 °C	130 °C	Male Pin	Tin-Lead	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	20	Board Guide	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-140	0.298 in	-55 °C	130 °C	Male Pin	Tin-Lead	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	80	Board Guide	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-105	0.298 in	-55 °C	130 °C	Male Pin	Tin-Lead	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	10	Board Guide	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin
Amphenol ICC (FCI) 90098-120CTLF	0.298 in	-55 °C	130 °C	Male Pin	Tin	Glass Filled Thermoplastic	Gold GXT™	Push-Pull	0.05 in	Board	Solder	All	40	Board Guide Pick and Place	30 µin	Header	Surface Mount	Shrouded - 4 Wall	Natural	0.13 in	Square	UL94 V-0	2	0.05 in	8.26 mm	100 Ąin