44-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Termination	Type	Type	Type	Contact Finish - Post	Features	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Contact Material - Post	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Housing Material	Current Rating (Amps)	Termination Post Length	Termination Post Length	Mounting Type
Aries Electronics 44-6575-11	5.08 µm	200 µin	UL94 V-0	Solder	15.24 mm	DIP ZIF (ZIP)	0.6 "	Tin	Closed Frame	44 Positions or Pins	200 µin	5.08 µm	Beryllium Copper	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	1 A	0.11 in	2.78 mm	Through Hole
Aries Electronics 44-6575-18	5.08 µm	200 µin	UL94 V-0	Solder	15.24 mm	DIP ZIF (ZIP)	0.6 "	Tin	Closed Frame	44 Positions or Pins	200 µin	5.08 µm	Beryllium Copper	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	1 A	0.11 in	2.78 mm	Through Hole
Aries Electronics 44-6575-10	5.08 µm	200 µin	UL94 V-0	Solder	15.24 mm	DIP ZIF (ZIP)	0.6 "	Tin	Closed Frame	44 Positions or Pins	200 µin	5.08 µm	Beryllium Copper	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	1 A	0.11 in	2.78 mm	Through Hole