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CONN IC DIP SOCKET 18POS GOLD
| Part | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish - Mating | Contact Finish - Post | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Type | Type | Type | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Material Flammability Rating | Features | Pitch - Post | Pitch - Post | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | 10 çin | 0.25 çm | Beryllium Copper | Gold | Gold | Glass Filled Nylon 4/6 Polyamide (PA46) | 30 Áin | 0.76 Ám | Solder | Through Hole | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | 3.56 mm | 0.14 in | 18 | UL94 V-0 | Closed Frame Elevated | 2.54 mm | 0.1 in | 3 A | 105 ░C | -55 °C |