CONN IC DIP SOCKET 18POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Material - Mating | Features | Pitch - Mating | Pitch - Mating | Type | Type | Type | Contact Finish - Mating | Termination Post Length | Termination Post Length | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Termination | Pitch - Post | Pitch - Post | Contact Material - Post | Current Rating (Amps) | Number of Positions or Pins (Grid) | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | UL94 V-0 | Phosphor Bronze | Closed Frame | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | Gold | 10.41 mm | 0.41 in | -55 °C | 125 °C | Through Hole | Wire Wrap | 2.54 mm | 0.1 in | Phosphor Bronze | 1.5 A | 18 | Gold | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) |
Aries Electronics | 200 µin | 5.08 µm | UL94 V-0 | Phosphor Bronze | Closed Frame | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | 10.41 mm | 0.41 in | -55 °C | 105 ░C | Through Hole | Wire Wrap | 2.54 mm | 0.1 in | Phosphor Bronze | 1.5 A | 18 | Tin | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | |
Aries Electronics | 200 µin | 5.08 µm | UL94 V-0 | Phosphor Bronze | Closed Frame | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | 17.52 mm | 0.69 in | -55 °C | 125 °C | Through Hole | Wire Wrap | 2.54 mm | 0.1 in | Phosphor Bronze | 1.5 A | 18 | Tin | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | |
Aries Electronics | 10 çin | 0.25 çm | UL94 V-0 | Phosphor Bronze | Closed Frame | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | Gold | 17.52 mm | 0.69 in | -55 °C | 125 °C | Through Hole | Wire Wrap | 2.54 mm | 0.1 in | Phosphor Bronze | 1.5 A | 18 | Gold | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) |