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CONN IC DIP SOCKET ZIF 40POS TIN
| Part | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Housing Material | Material Flammability Rating | Contact Finish - Post | Termination Post Length | Termination Post Length | Current Rating (Amps) | Termination | Features | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post | Mounting Type | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 40 | 20 | 2 | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Tin | 0.11 in | 2.78 mm | 1 A | Solder | Closed Frame | Beryllium Copper | 5.08 µm | 200 µin | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | |
Aries Electronics | 40 | 20 | 2 | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Gold | 0.11 in | 2.78 mm | 1 A | Solder | Closed Frame | Beryllium Copper | 0.25 çm | 10 çin | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | Gold |
Aries Electronics | 40 | 20 | 2 | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Nickel Boron | 0.11 in | 2.78 mm | 1 A | Solder | Closed Frame | Beryllium Nickel | 1.27 µm | 50 µin | 0.1 in | 2.54 mm | Beryllium Nickel | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 50 µin | 1.27 µm | 2.54 mm | 0.1 in | Nickel Boron |