CONN HEADER SMD 56POS 0.8MM
| Part | Contact Type | Pitch - Mating | Pitch - Mating | Mounting Type | Row Spacing - Mating | Row Spacing - Mating | Number of Rows | Contact Shape | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Connector Type | Shrouding | Insulation Height [z] | Insulation Height [z] | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Contact Material | Contact Length - Mating [x] | Contact Length - Mating [x] | Contact Finish - Mating | Number of Positions Loaded | Insulation Color | Current Rating (Amps) | Termination | Fastening Type | Insulation Material | Number of Positions | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating | Contact Length - Mating | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount | 1.2 mm | 0.047 in | 2 | Square | End Shrouds | 10 çin | 0.25 çm | Gold | Header | Unshrouded | 0.055 in | 1.4 mm | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | 1.9 mm | 0.075 in | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 | ||||||
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount | 1.2 mm | 0.047 in | 2 | Square | 10 çin | 0.25 çm | Gold | Header | Unshrouded | 0.055 in | 1.4 mm | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | 1.9 mm | 0.075 in | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 | 3 µin | 0.076 µm | |||||
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount | 1.2 mm | 0.047 in | 2 | Square | Board Guide Pick and Place | 10 çin | 0.25 çm | Gold | Header | Unshrouded | 0.055 in | 1.4 mm | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | 1.9 mm | 0.075 in | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 | ||||||
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount | 1.2 mm | 0.047 in | 2 | Square | 10 çin | 0.25 çm | Gold | Header | Unshrouded | 0.055 in | 1.4 mm | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | 1.9 mm | 0.075 in | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 | |||||||
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount | 1.2 mm | 0.047 in | 2 | Square | Board Guide | 10 çin | 0.25 çm | Gold | Header | Unshrouded | 0.055 in | 1.4 mm | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 | 3.05 mm | 0.12 in | ||||||
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount Right Angle | 1.2 mm | 0.047 in | 2 | Square | 10 çin | 0.25 çm | Gold | Header | Unshrouded | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | 1.9 mm | 0.075 in | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 | 3 µin | 0.076 µm | 3.05 mm | 0.12 in | |||||
Samtec Inc. | Male Pin | 0.031 in | 0.8 mm | Surface Mount | 1.2 mm | 0.047 in | 2 | Square | Pick and Place | 10 çin | 0.25 çm | Gold | Header | Unshrouded | 0.055 in | 1.4 mm | -55 °C | 125 °C | UL94 V-0 | Phosphor Bronze | 1.9 mm | 0.075 in | Gold | All | Black | 2.7 A | Solder | Push-Pull | Liquid Crystal Polymer (LCP) | 56 |