04-0518 Series
Manufacturer: Aries Electronics
CONN SOCKET SIP 4POS GOLD
| Part | Termination Post Length | Material Flammability Rating | Current Rating | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Material - Post | Contact Material - Mating | Contact Finish Thickness - Post | Termination | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Mounting Type | Pitch - Mating | Pitch - Post | Contact Finish - Mating | Type | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | UL94 V-0 | 3 A | Open Frame | Gold | 10 µin | Brass | Beryllium Copper | 10 µin | Solder | 1 | 4 | 4 | Through Hole | 0.1 in | 0.1 in | Gold | SIP | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.046 in | UL94 V-0 | 3 A | Open Frame | Tin | 10 µin | Brass | Beryllium Copper | 200 µin | Solder | 1 | 4 | 4 | Surface Mount | 0.1 in | 0.1 in | Gold | SIP | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.125 in | UL94 V-0 | 3 A | Open Frame | Tin | 10 µin | Brass | Beryllium Copper | 200 µin | Solder | 1 | 4 | 4 | Through Hole | 0.1 in | 0.1 in | Gold | SIP | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 0.125 in | UL94 V-0 | 3 A | Open Frame | Gold | 10 µin | Brass | Beryllium Copper | 10 µin | Solder | 1 | 4 | 4 | Through Hole | 0.1 in | 0.1 in | Gold | SIP | Glass Filled Nylon 4/6 PA46 Polyamide |