28-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS GLD

Part	Pitch - Mating	Pitch - Mating	Type	Type	Type	Features	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Contact Finish - Mating	Housing Material	Material Flammability Rating	Mounting Type	Termination	Contact Material - Post	Current Rating (Amps)	Contact Material - Mating	Number of Positions or Pins (Grid)
Aries Electronics 28-3575-11	0.1 in	2.54 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Closed Frame	Gold	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	0.11 in	2.78 mm	Gold	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Through Hole	Solder	Beryllium Copper	1 A	Beryllium Copper	28
Aries Electronics 28-3575-10	0.1 in	2.54 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Closed Frame	Gold	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	0.11 in	2.78 mm	Gold	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	Through Hole	Solder	Beryllium Copper	1 A	Beryllium Copper	28