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CONN IC DIP SOCKET 16POS GOLD
| Part | Type | Type | Type | Contact Material - Mating | Termination | Housing Material | Features | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish - Post | Number of Positions or Pins (Grid) | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] | Mounting Type | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.3 " | 7.62 mm | DIP | Beryllium Copper | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame Elevated | Gold | 0.1 in | 2.54 mm | 3.56 mm | 0.14 in | 3 A | Gold | 16 | 105 ░C | -55 °C | Brass | Through Hole | UL94 V-0 | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | 2.54 mm | 0.1 in |