CONN EDGE DUAL FMALE 16POS 0.05
| Part | Termination | Features | Read Out | Number of Rows | Material - Insulation | Contact Material | Gender | Card Type | Number of Positions | Card Thickness | Card Thickness | Mounting Type | Contact Type | Contact Finish Thickness | Contact Finish Thickness | Operating Temperature [Min] | Operating Temperature [Max] | Color | Pitch [x] | Pitch [x] | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Board Guide | Dual | 2 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female | Non Specified - Dual Edge | 16 | 0.062 in | 1.57 mm | Surface Mount | Cantilever | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Black | 0.05 in | 1.27 mm | Gold |
Samtec Inc. | Solder | Board Guide | Dual | 2 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female | Non Specified - Dual Edge | 16 | 0.062 in | 1.57 mm | Surface Mount | Cantilever | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Black | 0.05 in | 1.27 mm | Gold |
Samtec Inc. | Solder | Board Guide | Dual | 2 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female | Non Specified - Dual Edge | 16 | 0.062 in | 1.57 mm | Surface Mount | Cantilever | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Black | 0.05 in | 1.27 mm | Gold |
Samtec Inc. | Solder | Board Guide | Dual | 2 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female | Non Specified - Dual Edge | 16 | 0.093 in | 2.36 mm | Surface Mount | Cantilever | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Natural | 0.05 in | 1.27 mm | Gold |