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TMM-137 Series

Manufacturer: Samtec Inc.

Catalog

CONN HEADER VERT 74POS 2MM

PartFastening TypeContact Finish - PostInsulation MaterialContact Finish - MatingOperating Temperature [Min]Operating Temperature [Max]Row Spacing - MatingRow Spacing - MatingPitch - Mating [x]Pitch - Mating [x]Number of RowsOverall Contact LengthOverall Contact LengthContact Finish Thickness - MatingContact Finish Thickness - MatingContact Finish Thickness - PostContact Finish Thickness - PostNumber of Positions LoadedContact TypeContact MaterialMounting TypeContact Length - MatingContact Length - MatingConnector TypeContact Length - PostContact Length - PostInsulation ColorShroudingContact ShapeInsulation HeightInsulation HeightCurrent Rating (Amps)StyleTerminationNumber of PositionsMaterial Flammability RatingContact Length - Post [x]Contact Length - Post [x]
Samtec Inc.
Push-Pull
Gold
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
0.079 in
2 mm
2
8.2 mm
0.323 in
0.51 µm
20 µin
3 µin
0.076 µm
All
Male Pin
Phosphor Bronze
Through Hole
3.2 mm
0.126 "
Header
3.5 mm
0.138 in
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
74
Samtec Inc.
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
-55 °C
105 ░C
0.079 in
2 mm
1
8.2 mm
0.323 in
All
Male Pin
Phosphor Bronze
Through Hole
3.2 mm
0.126 "
Header
3.5 mm
0.138 in
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
37
Samtec Inc.
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
1
8.2 mm
0.323 in
0.76 Ám
30 Áin
All
Male Pin
Phosphor Bronze
Through Hole
3.2 mm
0.126 "
Header
3.5 mm
0.138 in
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
37
Push-Pull
Gold
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
1
0.51 µm
20 µin
3 µin
0.076 µm
All
Male Pin
Phosphor Bronze
Surface Mount
3.2 mm
0.126 "
Header
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
37
UL94 V-0
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
-55 °C
105 ░C
0.079 in
2 mm
0.079 in
2 mm
All
Male Pin
Phosphor Bronze
Through Hole
Right Angle
3.2 mm
0.126 "
Header
Black
Unshrouded
Square
8 mm
0.315 in
3.2 A
Board to Board
Cable
Solder
148
0.12 in
3.05 mm
Push-Pull
Gold
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
0.079 in
2 mm
2
0.51 µm
20 µin
3 µin
0.076 µm
All
Male Pin
Phosphor Bronze
Through Hole
Right Angle
3.2 mm
0.126 "
Header
Black
Unshrouded
Square
3.94 mm
0.155 in
3.2 A
Board to Board
Cable
Solder
74
0.12 in
3.05 mm
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
0.079 in
2 mm
2
0.76 Ám
30 Áin
All
Male Pin
Phosphor Bronze
Through Hole
Right Angle
3.2 mm
0.126 "
Header
Black
Unshrouded
Square
3.94 mm
0.155 in
3.2 A
Board to Board
Cable
Solder
74
0.12 in
3.05 mm
Samtec Inc.
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
0.079 in
2 mm
2
8.2 mm
0.323 in
0.25 çm
10 çin
All
Male Pin
Phosphor Bronze
Through Hole
4 mm
0.157 in
Header
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
74
0.106 in
2.69 mm
Samtec Inc.
Push-Pull
Gold
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
1
8.2 mm
0.323 in
0.51 µm
20 µin
3 µin
0.076 µm
All
Male Pin
Phosphor Bronze
Through Hole
3.2 mm
0.126 "
Header
3.5 mm
0.138 in
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
37
Samtec Inc.
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Gold
-55 °C
125 °C
0.079 in
2 mm
1
8.2 mm
0.323 in
0.25 çm
10 çin
All
Male Pin
Phosphor Bronze
Through Hole
3.2 mm
0.126 "
Header
3.5 mm
0.138 in
Black
Unshrouded
Square
1.5 mm
0.059 "
3.2 A
Board to Board
Cable
Solder
37