TMM-137 Series

Catalog

CONN HEADER VERT 74POS 2MM

Part	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Style	Shrouding	Row Spacing - Mating	Contact Shape	Pitch - Mating	Insulation Material	Contact Material	Number of Positions	Contact Finish - Post	Contact Length - Post	Contact Type	Current Rating (Per Contact)	Number of Positions Loaded	Connector Type	Overall Contact Length	Number of Rows	Mounting Type	Contact Finish Thickness - Mating	Contact Length - Mating	Insulation Height	Contact Finish - Mating	Fastening Type	Insulation Color	Contact Finish Thickness - Post	Material Flammability Rating
Samtec Inc. TMM-137-01-G-D	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	74	Gold	0.138 in	Male Pin	3.2 A	All	Header	0.323 in	2	Through Hole	20 Ąin	0.126 in	0.059 in	Gold	Push-Pull	Black	3 µin
Samtec Inc. TMM-137-01-T-D-SM	105 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	74	Tin		Male Pin	3.2 A	All	Header		2	Surface Mount		0.126 in	0.059 in	Tin	Push-Pull	Black		UL94 V-0
Samtec Inc. TMM-137-01-T-S	105 °C	-55 °C	Solder	Board Board or Cable	Unshrouded		Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	37 pos	Tin	0.138 in	Male Pin	3.2 A	All	Header	0.323 in	1	Through Hole		0.126 in	0.059 in	Tin	Push-Pull	Black
Samtec Inc. TMM-137-01-S-S	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded		Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	37 pos	Tin	0.138 in	Male Pin	3.2 A	All	Header	0.323 in	1	Through Hole	30 µin	0.126 in	0.059 in	Gold	Push-Pull	Black
Samtec Inc. TMM-137-01-G-S-SM	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded		Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	37 pos	Gold		Male Pin	3.2 A	All	Header		1	Surface Mount	20 Ąin	0.126 in	0.059 in	Gold	Push-Pull	Black	3 µin	UL94 V-0
Samtec Inc. TMM-137-01-T-Q-RA	105 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	148	Tin	0.12 in	Male Pin	3.2 A	All	Header		4	Right Angle Through Hole		0.126 in	0.315 in	Tin	Push-Pull	Black
Samtec Inc. TMM-137-01-G-D-RA	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	74	Gold	0.12 in	Male Pin	3.2 A	All	Header		2	Right Angle Through Hole	20 Ąin	0.126 in	0.155 in	Gold	Push-Pull	Black	3 µin
Samtec Inc. TMM-137-03-G-D	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	74	Gold	0.106 in	Male Pin	3.2 A	All	Header	0.323 in	2	Through Hole	20 Ąin	0.157 in	0.059 in	Gold	Push-Pull	Black	3 µin
Samtec Inc. TMM-137-01-S-D-RA	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	74	Tin	0.12 in	Male Pin	3.2 A	All	Header		2	Right Angle Through Hole	30 µin	0.126 in	0.155 in	Gold	Push-Pull	Black
Samtec Inc. TMM-137-03-L-D	125 °C	-55 °C	Solder	Board Board or Cable	Unshrouded	0.079 in	Square	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	74	Tin	0.106 in	Male Pin	3.2 A	All	Header	0.323 in	2	Through Hole	10 µin	0.157 in	0.059 in	Gold	Push-Pull	Black