CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Pitch - Post | Pitch - Post | Contact Finish - Mating | Housing Material | Number of Positions or Pins (Grid) | Type | Type | Type | Features | Mounting Type | Current Rating (Amps) | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish - Post | Contact Material - Post | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6575-16 | 2.54 mm | 0.1 in | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Closed Frame | Through Hole | 1 A | Solder | 10 çin | 0.25 çm | UL94 V-0 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Beryllium Copper | Gold | Beryllium Copper | 0.11 in | 2.78 mm |
Aries Electronics 48-6575-11 | 2.54 mm | 0.1 in | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Closed Frame | Through Hole | 1 A | Solder | 10 çin | 0.25 çm | UL94 V-0 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Beryllium Copper | Gold | Beryllium Copper | 0.11 in | 2.78 mm |
Aries Electronics 48-6575-10 | 2.54 mm | 0.1 in | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Closed Frame | Through Hole | 1 A | Solder | 10 çin | 0.25 çm | UL94 V-0 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Beryllium Copper | Gold | Beryllium Copper | 0.11 in | 2.78 mm |