CONN IC DIP SOCKET 38POS GOLD
| Part | Features | Housing Material | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Termination | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | Polyamide (PA46) Nylon 4/6 | 1.5 A | 0.1 in | 2.54 mm | UL94 V-0 | 10 çin | 0.25 çm | Phosphor Bronze | Gold | 2.54 mm | 0.1 in | 0.145 " | 3.68 mm | Solder | Phosphor Bronze | 10 çin | 0.25 çm | DIP | 0.6 in | 15.24 mm | Gold | 38 | |||
Aries Electronics | Closed Frame | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | 0.1 in | 2.54 mm | UL94 V-0 | 200 µin | 5.08 µm | Beryllium Copper | Gold | 2.54 mm | 0.1 in | 0.14 in | 3.56 mm | Solder | 30 Áin | 0.76 Ám | DIP | 0.6 in | 15.24 mm | Tin | 38 | Brass | 105 ░C | -55 °C | |
Aries Electronics | Closed Frame | Polyamide (PA46) Nylon 4/6 | 1.5 A | 0.1 in | 2.54 mm | UL94 V-0 | 200 µin | 5.08 µm | Phosphor Bronze | 2.54 mm | 0.1 in | 0.145 " | 3.68 mm | Solder | Phosphor Bronze | 200 µin | 5.08 µm | DIP | 0.6 in | 15.24 mm | Tin | 38 |