28-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS

Part	Material Flammability Rating	Termination Post Length	Current Rating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Row Spacing	Type	Contact Material - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish - Mating	Termination	Housing Material	Contact Material - Post	Contact Finish Thickness - Post	Features	Pitch - Post	Pitch - Mating	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 28-3554-16	UL94 V-0	0.11 in	1 A	2	24	12	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	Through Hole	50 µin	Boron Nickel	Solder	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	50 µin	Closed Frame	0.1 in	0.1 in	Nickel Boron	250 °C	-55 °C
Aries Electronics 28-3554-18	UL94 V-0	0.11 in	1 A	2	24	12	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Nickel	Through Hole	50 µin	Boron Nickel	Solder	Glass Filled PEEK Polyetheretherketone	Beryllium Nickel	50 µin	Closed Frame	0.1 in	0.1 in	Nickel Boron	250 °C	-55 °C