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CONN IC DIP SOCKET ZIF 24POS
| Part | Mounting Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Material - Post | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Pitch - Post | Pitch - Post | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Termination Post Length | Termination Post Length | Type | Type | Type | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | 24 | Nickel Boron | Nickel Boron | Closed Frame | 1.27 µm | 50 µin | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper | UL94 V-0 | 1.27 µm | 50 µin | Solder | 2.54 mm | 0.1 in | 1 A | -55 °C | 250 °C | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | Through Hole | 24 | Nickel Boron | Nickel Boron | Closed Frame | 1.27 µm | 50 µin | 0.1 in | 2.54 mm | Beryllium Nickel | Beryllium Nickel | UL94 V-0 | 1.27 µm | 50 µin | Solder | 2.54 mm | 0.1 in | 1 A | -55 °C | 250 °C | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyetheretherketone (PEEK) Glass Filled |