16-C195 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Current Rating | Row Spacing | Type | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Contact Finish - Mating | Termination | Mounting Type | Operating Temperature (Min) | Operating Temperature (Max) | Contact Material - Mating | Features | Housing Material | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Pitch - Mating | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Tin | 200 µin | Brass | Gold | Wire Wrap | Through Hole | -55 °C | 105 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Tin | 200 µin | Brass | Gold | Solder | Surface Mount | -55 °C | 105 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |
Aries Electronics | UL94 V-0 | 0.125 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Gold | 10 µin | Brass | Gold | Solder | Through Hole | -55 °C | 125 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |
Aries Electronics | UL94 V-0 | 0.125 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Tin | 200 µin | Brass | Gold | Solder | Through Hole | -55 °C | 105 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Tin | 200 µin | Brass | Gold | Wire Wrap | Through Hole | -55 °C | 105 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Gold | 10 µin | Brass | Gold | Wire Wrap | Through Hole | -55 °C | 125 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |
Aries Electronics | UL94 V-0 | 0.04 in | 3 A | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 µin | Gold | 10 µin | Brass | Gold | Wire Wrap | Through Hole | -55 °C | 125 °C | Beryllium Copper | Closed Frame | Glass Filled Nylon 4/6 PA46 Polyamide | 2 | 16 | 8 | 0.1 in | 0.1 in |