44-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Termination Post Length	Current Rating	Material Flammability Rating	Contact Finish Thickness - Post	Pitch - Post	Pitch - Mating	Contact Finish - Post	Row Spacing	Type	Mounting Type	Features	Contact Finish - Mating	Housing Material	Contact Material - Post	Number of Positions or Pins (Grid)	Grid Rows	Grid Columns	Contact Finish Thickness - Mating	Contact Material - Mating	Termination
Aries Electronics 44-3574-10	0.11 in	1 A	UL94 V-0	200 µin	0.1 in	0.1 in	Tin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Tin	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	44	2	22	200 Ąin	Beryllium Copper	Solder
Aries Electronics 44-3574-16	0.11 in	1 A	UL94 V-0	200 µin	0.1 in	0.1 in	Tin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Tin	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	44	2	22	200 Ąin	Beryllium Copper	Solder
Aries Electronics 44-3574-18	0.11 in	1 A	UL94 V-0	200 µin	0.1 in	0.1 in	Tin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Tin	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	44	2	22	200 Ąin	Beryllium Copper	Solder
Aries Electronics 44-3574-11	0.11 in	1 A	UL94 V-0	200 µin	0.1 in	0.1 in	Tin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Tin	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	44	2	22	200 Ąin	Beryllium Copper	Solder