44-6570 Series
Manufacturer: Aries Electronics
Catalog
CONN IC DIP SOCKET ZIF 44POS
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish - Mating | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Features | Mounting Type | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Material - Post | Termination | Current Rating (Amps) | Contact Finish - Post | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1.27 µm | 50 µin | Beryllium Nickel | Nickel Boron | 44 Positions or Pins | 0.1 in | 2.54 mm | Closed Frame | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | UL94 V-0 | Beryllium Nickel | Solder | 1 A | Nickel Boron | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |
Aries Electronics | 0.25 çm | 10 çin | Beryllium Copper | Gold | 44 Positions or Pins | 0.1 in | 2.54 mm | Closed Frame | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 0.25 çm | 10 çin | UL94 V-0 | Beryllium Copper | Solder | 1 A | Gold | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |
Aries Electronics | 5.08 µm | 200 µin | Beryllium Copper | 44 Positions or Pins | 0.1 in | 2.54 mm | Closed Frame | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | UL94 V-0 | Beryllium Copper | Solder | 1 A | Tin | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |