44-6570 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Features	Mounting Type	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Material - Post	Termination	Current Rating (Amps)	Contact Finish - Post	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Type	Type	Type
Aries Electronics 44-6570-16	1.27 µm	50 µin	Beryllium Nickel	Nickel Boron	44 Positions or Pins	0.1 in	2.54 mm	Closed Frame	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	UL94 V-0	Beryllium Nickel	Solder	1 A	Nickel Boron	0.11 in	2.78 mm	2.54 mm	0.1 in	15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 44-6570-11	0.25 çm	10 çin	Beryllium Copper	Gold	44 Positions or Pins	0.1 in	2.54 mm	Closed Frame	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	0.25 çm	10 çin	UL94 V-0	Beryllium Copper	Solder	1 A	Gold	0.11 in	2.78 mm	2.54 mm	0.1 in	15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 44-6570-10	5.08 µm	200 µin	Beryllium Copper		44 Positions or Pins	0.1 in	2.54 mm	Closed Frame	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	UL94 V-0	Beryllium Copper	Solder	1 A	Tin	0.11 in	2.78 mm	2.54 mm	0.1 in	15.24 mm	DIP ZIF (ZIP)	0.6 "