.200 HI POWER SOCKET ASSEMBLY
| Part | Contact Material | Insulation Material | Number of Positions Loaded | Termination | Connector Type | Contact Type | Mounting Type | Fastening Type | Insulation Color | Contact Shape | Insulation Height | Insulation Height | Pitch - Mating | Pitch - Mating | Features | Number of Rows | Contact Finish - Post | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Solder | Receptacle | Female Socket | Surface Mount | Push-Pull | Black | Square | 8.92 mm | 0.351 in | 5.08 mm | 0.2 in | Pick and Place | 1 | Tin | 12 |
Samtec Inc. | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Solder | Receptacle | Female Socket | Surface Mount | Push-Pull | Black | Square | 8.92 mm | 0.351 in | 5.08 mm | 0.2 in | Pick and Place | 1 | Tin | 12 |
Samtec Inc. | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Solder | Receptacle | Female Socket | Surface Mount | Push-Pull | Black | Square | 8.92 mm | 0.351 in | 5.08 mm | 0.2 in | Board Lock Pick and Place | 1 | Tin | 12 |