MPC82 Series
Manufacturer: NXP USA Inc.
IC MPU MPC82XX 300MHZ 480TBGA
| Part | Ethernet Ports | Ethernet Speed Options | Package Length | Package Name | Package Width | Speed | Voltage - I/O | Operating Temperature (Max) | Operating Temperature (Min) | Package / Case | RAM Controllers | Additional Interfaces | Bus Width | Number of Cores | Graphics Acceleration | Mounting Type | Core Processor | Co-Processors/DSP | For Use With/Related Products | Accessory Type | Utilized IC / Part |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 3 | 100Mbps 10Mbps | 37.5 mm | 480-TBGA | 37.5 mm | 300 MHz | 3.3 V | 105 °C | 0 °C | 480-LBGA Exposed Pad | DRAM SDRAM | I2C SCC SMC SPI UART USART | 32 Bit | 1 Core | No | Surface Mount | PowerPC G2 | Communications RISC CPM | |||
NXP USA Inc. | 3 | 100Mbps 10Mbps | 37.5 mm | 480-TBGA | 37.5 mm | 300 MHz | 3.3 V | 105 °C | 0 °C | 480-LBGA Exposed Pad | DRAM SDRAM | I2C SCC SMC SPI UART USART | 32 Bit | 1 Core | No | Surface Mount | PowerPC G2 | Communications RISC CPM | |||
NXP USA Inc. | 8260ADS | Interface Board | 8260ADS | ||||||||||||||||||
NXP USA Inc. | 3 | 100Mbps 10Mbps | 37.5 mm | 480-TBGA | 37.5 mm | 300 MHz | 3.3 V | 105 °C | 0 °C | 480-LBGA Exposed Pad | DRAM SDRAM | I2C SCC SMC SPI UART USART | 32 Bit | 1 Core | No | Surface Mount | PowerPC G2 | Communications RISC CPM | |||
NXP USA Inc. | 35 mm | 352-TBGA | 35 mm | 333 MHz | 3.3 V | 105 °C | -40 °C | 352-LBGA | SDRAM | I2C I²O PCI UART | 32 Bit | 1 Core | No | Surface Mount | PowerPC 603e | ||||||
NXP USA Inc. | 25 mm | 357-PBGA | 25 mm | 166 MHz | 3.3 V | 105 °C | -40 °C | 357-BBGA | SDRAM | I2C I²O PCI UART | 32 Bit | 1 Core | No | Surface Mount | PowerPC 603e | ||||||
NXP USA Inc. | 3 | 100Mbps 10Mbps | 37.5 mm | 480-TBGA | 37.5 mm | 300 MHz | 3.3 V | 105 °C | 0 °C | 480-LBGA Exposed Pad | DRAM SDRAM | I2C SCC SMC SPI UART USART | 32 Bit | 1 Core | No | Surface Mount | PowerPC G2 | Communications RISC CPM | |||
NXP USA Inc. | 3 | 100Mbps 10Mbps | 27 mm | 516-PBGA | 27 mm | 200 MHz | 3.3 V | 105 °C | -40 °C | 516-BBGA | DRAM SDRAM | I2C SCC SMC SPI UART USART | 32 Bit | 1 Core | No | Surface Mount | PowerPC G2 | Communications RISC CPM | |||
NXP USA Inc. | 3 | 100Mbps 10Mbps | 37.5 mm | 480-TBGA | 37.5 mm | 300 MHz | 3.3 V | 105 °C | 0 °C | 480-LBGA Exposed Pad | DRAM SDRAM | I2C SCC SMC SPI UART USART | 32 Bit | 1 Core | No | Surface Mount | PowerPC G2 | Communications RISC CPM | |||
NXP USA Inc. | 35 mm | 352-TBGA | 35 mm | 300 MHz | 3.3 V | 105 °C | -40 °C | 352-LBGA | SDRAM | I2C I²O PCI UART | 32 Bit | 1 Core | No | Surface Mount | PowerPC 603e |