CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Current Rating (Amps) | Termination | Mounting Type | Pitch - Post | Pitch - Post | Housing Material | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Contact Material - Mating | Number of Positions or Pins (Grid) | Features | Termination Post Length | Termination Post Length | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6572-10 | 10 çin | 0.25 çm | UL94 V-0 | 1 A | Solder | Through Hole | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 10 çin | 0.25 çm | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Beryllium Copper | 48 | Closed Frame | 0.11 in | 2.78 mm | Gold |
Aries Electronics 48-6572-16 | 10 çin | 0.25 çm | UL94 V-0 | 1 A | Solder | Through Hole | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 10 çin | 0.25 çm | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Beryllium Copper | 48 | Closed Frame | 0.11 in | 2.78 mm | Gold |