BBL-129 Series
Manufacturer: Samtec Inc.
CONN HEADR LOPRO 29POS .100 TIN
| Part | Insulation Height | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions | Contact Type | Contact Length - Mating | Contact Finish - Mating | Fastening Type | Overall Contact Length | Style | Shrouding | Contact Length - Post | Insulation Material | Pitch - Mating | Insulation Color | Contact Shape | Number of Positions Loaded | Mounting Type | Termination | Connector Type | Number of Rows | Contact Finish Thickness - Post | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.07 in | Nickel | 125 °C | -55 °C | 29 | Male Pin | 0.105 in | Tin | Push-Pull | 0.3 in | Board | Unshrouded | 0.125 in | Liquid Crystal Polymer (LCP) | 0.1 in | Black | Circular | All | Through Hole | Solder | Header | 1 | 50 µin | |
Samtec Inc. | 0.085 in | Nickel | 125 °C | -55 °C | 29 | Male Pin | 0.122 in | Tin | Push-Pull | 0.332 in | Board | Unshrouded | 0.125 in | Liquid Crystal Polymer (LCP) | 0.1 in | Black | Circular | All | Through Hole | Solder | Header | 1 | 50 µin | |
Samtec Inc. | 0.07 in | Nickel | 125 °C | -55 °C | 29 | Male Pin | 0.105 in | Gold | Push-Pull | 0.3 in | Board | Unshrouded | 0.125 in | Liquid Crystal Polymer (LCP) | 0.1 in | Black | Circular | All | Through Hole | Solder | Header | 1 | 50 µin | 20 Ąin |