M2GL090T Series
Manufacturer: Microchip Technology
IGLOO2 LOW DENSITY FPGA, 86KLES 325 TFBGA 11X13.5X1.16MM TRAY ROHS COMPLIANT: YES
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Package Width | Package Name | Package Length | Number of Logic Elements/Cells | Package / Case | Total RAM Bits | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Number of I/O |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 85 °C | 0 °C | Surface Mount | 11 mm | 325-FCBGA | 11 mm | 86184 | 325-TFBGA FCBGA | 2648064 bits | 1.14 V | 2.625 V | 180 |
Microchip Technology | 100 °C | -40 °C | Surface Mount | 11 mm | 325-FCBGA | 11 mm | 86184 | 325-TFBGA FCBGA | 2648064 bits | 1.14 V | 2.625 V | 180 |
Microchip Technology | 85 °C | 0 °C | Surface Mount | 23 mm | 484-FPBGA | 23 mm | 86316 | 484-BGA | 2648064 bits | 1.14 V | 2.625 V | 267 |
Microchip Technology | 125 °C | -55 °C | Surface Mount | 23 mm | 484-FPBGA | 23 mm | 86184 | 484-BGA | 2648064 bits | 1.14 V | 2.625 V | 267 |
Microchip Technology | 85 °C | 0 °C | Surface Mount | 27 mm | 676-FBGA | 27 mm | 86316 | 676-BGA | 2648064 bits | 1.14 V | 2.625 V | 425 |
Microchip Technology | 85 °C | 0 °C | Surface Mount | 27 mm | 676-FBGA | 27 mm | 86316 | 676-BGA | 2648064 bits | 1.14 V | 2.625 V | 425 |
Microchip Technology | 85 °C | 0 °C | Surface Mount | 23 mm | 484-FPBGA | 23 mm | 86316 | 484-BGA | 2648064 bits | 1.14 V | 2.625 V | 267 |
Microchip Technology | 100 °C | -40 °C | Surface Mount | 23 mm | 484-FPBGA | 23 mm | 86316 | 484-BGA | 2648064 bits | 1.14 V | 2.625 V | 267 |
Microchip Technology | 100 °C | -40 °C | Surface Mount | 23 mm | 484-FPBGA | 23 mm | 86184 | 484-BGA | 2648064 bits | 1.14 V | 2.625 V | 267 |
Microchip Technology | 100 °C | -40 °C | Surface Mount | 27 mm | 676-FBGA | 27 mm | 86184 | 676-BGA | 2648064 bits | 1.14 V | 2.625 V | 425 |