Beta
⌘K
CONN IC DIP SOCKET 16POS GOLD
| Part | Housing Material | Termination Post Length | Termination Post Length | Current Rating (Amps) | Termination | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Material Flammability Rating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.56 mm | 0.14 in | 3 A | Solder | 2.54 mm | 0.1 in | Brass | UL94 V-0 | Beryllium Copper | 10 çin | 0.25 çm | 0.3 " | 7.62 mm | DIP | Gold | 30 Áin | 0.76 Ám | Through Hole | 105 ░C | -55 °C | Gold | 16 | 0.1 in | 2.54 mm | Closed Frame Elevated |
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.56 mm | 0.14 in | 3 A | Solder | 2.54 mm | 0.1 in | Brass | UL94 V-0 | Beryllium Copper | 10 çin | 0.25 çm | 0.6 in | 15.24 mm | DIP | Gold | 30 Áin | 0.76 Ám | Through Hole | 105 ░C | -55 °C | Gold | 16 | 0.1 in | 2.54 mm | Closed Frame Elevated |