18-6513 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Features	Contact Material - Post [custom]	Termination	Contact Finish - Post	Operating Temperature [Max]	Operating Temperature [Min]	Material Flammability Rating	Current Rating (Amps)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Type	Type	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Housing Material
Aries Electronics 18-6513-11	10 çin	0.25 çm	Through Hole	18	2.54 mm	0.1 in	Closed Frame	Brass	Solder	Gold	105 ░C	-55 °C	UL94 V-0	3 A	Beryllium Copper	0.1 in	2.54 mm	DIP	0.6 in	15.24 mm	Gold	10 çin	0.25 çm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 18-6513-10	10 çin	0.25 çm	Through Hole	18	2.54 mm	0.1 in	Closed Frame	Brass	Solder	Tin	105 ░C	-55 °C	UL94 V-0	3 A	Beryllium Copper	0.1 in	2.54 mm	DIP	0.6 in	15.24 mm	Gold	200 µin	5.08 µm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 18-6513-10H	10 çin	0.25 çm	Through Hole	18	2.54 mm	0.1 in	Closed Frame	Brass	Solder	Tin	105 ░C	-55 °C	UL94 V-0	3 A	Beryllium Copper	0.1 in	2.54 mm	DIP	0.6 in	15.24 mm	Gold	200 µin	5.08 µm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)