48-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Housing Material	Contact Finish - Post	Contact Material - Post	Contact Finish Thickness - Mating	Pitch - Mating	Termination	Pitch - Post	Contact Finish - Mating	Mounting Type	Features	Row Spacing	Type	Contact Material - Mating	Current Rating	Termination Post Length	Material Flammability Rating
Aries Electronics 48-6574-10	10 µin	48	24	2	Glass Filled Polyphenylene Sulfide PPS	Gold	Beryllium Copper	10 µin	0.1 in	Solder	0.1 in	Gold	Through Hole	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	1 A	0.11 in	UL94 V-0
Aries Electronics 48-6574-18	10 µin	48	24	2	Glass Filled Polyphenylene Sulfide PPS	Gold	Beryllium Copper	10 µin	0.1 in	Solder	0.1 in	Gold	Through Hole	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	1 A	0.11 in	UL94 V-0
Aries Electronics 48-6574-11	10 µin	48	24	2	Glass Filled Polyphenylene Sulfide PPS	Gold	Beryllium Copper	10 µin	0.1 in	Solder	0.1 in	Gold	Through Hole	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	1 A	0.11 in	UL94 V-0