08-6513 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Type	Type	Type	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish - Post	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]	Termination	Contact Finish - Mating	Housing Material
Aries Electronics 08-6513-11	10 çin	0.25 çm	3.18 mm	0.125 in	10 çin	0.25 çm	Closed Frame	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	8	Brass	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Gold	3 A	105 ░C	-55 °C	Solder	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 08-6513-10H	10 çin	0.25 çm	3.18 mm	0.125 in	200 µin	5.08 µm	Closed Frame	UL94 V-0	0.1 in	2.54 mm	Beryllium Copper	8	Brass	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Tin	3 A	105 ░C	-55 °C	Solder	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)