42-6572 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Material Flammability Rating	Current Rating	Termination Post Length	Contact Finish - Post	Termination	Contact Finish - Mating	Mounting Type	Housing Material	Contact Finish Thickness - Mating	Features	Pitch - Mating	Pitch - Post	Contact Material - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Row Spacing	Type	Contact Material - Mating
Aries Electronics 42-6572-10	UL94 V-0	1 A	0.11 in	Tin	Solder	Tin	Through Hole	Glass Filled Polyphenylene Sulfide PPS	200 Ąin	Closed Frame	0.1 in	0.1 in	Beryllium Copper	200 µin	42	21	2	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper
Aries Electronics 42-6572-11	UL94 V-0	1 A	0.11 in	Tin	Solder	Tin	Through Hole	Glass Filled Polyphenylene Sulfide PPS	200 Ąin	Closed Frame	0.1 in	0.1 in	Beryllium Copper	200 µin	42	21	2	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper
Aries Electronics 42-6572-16	UL94 V-0	1 A	0.11 in	Tin	Solder	Tin	Through Hole	Glass Filled Polyphenylene Sulfide PPS	200 Ąin	Closed Frame	0.1 in	0.1 in	Beryllium Copper	200 µin	42	21	2	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper