HTSS-115 Series

Catalog

CONN HEADER R/A 30POS 2.54MM

Part	Material Flammability Rating	Termination	Mounting Type	Contact Length - Post	Contact Shape	Insulation Color	Contact Finish - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Style	Contact Finish - Post	Row Spacing - Mating	Contact Material	Features	Number of Rows	Number of Positions Loaded	Pitch - Mating	Contact Type	Shrouding	Insulation Material	Number of Positions	Fastening Type	Insulation Height	Connector Type	Contact Length - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Overall Contact Length
Samtec Inc. HTSS-115-04-T-D-RA	UL94 V-0	Solder	Right Angle Through Hole	0.13 in	Square	Natural	Tin	-55 °C	105 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.365 in	Header	0.25 in
Samtec Inc. HTSS-115-01-H-DV	UL94 V-0	Solder	Surface Mount		Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Gold	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.35 in	Header	0.25 in	30 µin	3 µin
Samtec Inc. HTSS-115-04-L-D-RA	UL94 V-0	Solder	Right Angle Through Hole	0.13 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.365 in	Header	0.25 in	10 µin
Samtec Inc. HTSS-115-01-L-DV-A	UL94 V-0	Solder	Surface Mount		Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Board Guide Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.35 in	Header	0.25 in	10 µin
Samtec Inc. HTSS-115-02-L-D-LL	UL94 V-0	Solder	Through Hole	0.165 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.35 in	Header	0.25 in	10 µin		0.53 in
Samtec Inc. HTSS-115-04-F-D-RA	UL94 V-0	Solder	Right Angle Through Hole	0.13 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.365 in	Header	0.25 in	3 µin
Samtec Inc. HTSS-115-02-S-D	UL94 V-0	Solder	Through Hole	0.165 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.35 in	Header	0.25 in	30 µin		0.53 in
Samtec Inc. HTSS-115-01-H-D	UL94 V-0	Solder	Through Hole	0.115 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Gold	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.35 in	Header	0.25 in	30 µin	3 µin	0.48 in
Samtec Inc. HTSS-115-04-S-D-RA	UL94 V-0	Solder	Right Angle Through Hole	0.13 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.365 in	Header	0.25 in	30 µin
Samtec Inc. HTSS-115-01-L-D	UL94 V-0	Solder	Through Hole	0.115 in	Square	Natural	Gold	-55 °C	125 °C	Board Board or Cable	Tin	0.1 in	Phosphor Bronze	Keying Slot	2	All	0.1 in	Male Pin	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	30	Push-Pull	0.35 in	Header	0.25 in	10 µin		0.48 in