16-6511 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Material Flammability Rating	Contact Finish - Mating	Type	Type	Type	Mounting Type	Current Rating (Amps)	Contact Material - Post	Contact Material - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length
Aries Electronics 16-6511-11	Closed Frame	10 çin	0.25 çm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	10 çin	0.25 çm	-55 °C	125 °C	Solder	UL94 V-0	Gold	DIP	0.6 in	15.24 mm	Through Hole	1 A	Phosphor Bronze	Phosphor Bronze	16	2.54 mm	0.1 in	0.15 in	3.81 mm
Aries Electronics 16-6511-11WR	Closed Frame	10 çin	0.25 çm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	10 çin	0.25 çm	-55 °C	125 °C	Solder	UL94 V-0	Gold	DIP	0.6 in	15.24 mm	Through Hole	1 A	Phosphor Bronze	Phosphor Bronze	16	2.54 mm	0.1 in	0.15 in	3.81 mm
Aries Electronics 16-6511-10	Closed Frame	200 µin	5.08 µm	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	200 µin	5.08 µm	-55 °C	105 ░C	Solder	UL94 V-0		DIP	0.6 in	15.24 mm	Through Hole	1 A	Phosphor Bronze	Phosphor Bronze	16	2.54 mm	0.1 in	0.15 in	3.81 mm