42-6573 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 42POS TIN
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Contact Finish - Post | Contact Finish Thickness - Post | Row Spacing | Type | Pitch - Mating | Number of Positions or Pins (Grid) | Grid Columns | Grid Rows | Features | Mounting Type | Contact Material - Post | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Mating | Termination | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Tin | 200 µin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 42 | 21 | 2 | Closed Frame | Through Hole | Beryllium Copper | 200 Ąin | Beryllium Copper | 0.1 in | Tin | Solder | Glass Filled Polyphenylene Sulfide PPS |
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Tin | 200 µin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 42 | 21 | 2 | Closed Frame | Through Hole | Beryllium Copper | 200 Ąin | Beryllium Copper | 0.1 in | Tin | Solder | Glass Filled Polyphenylene Sulfide PPS |
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Tin | 200 µin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 42 | 21 | 2 | Closed Frame | Through Hole | Beryllium Copper | 200 Ąin | Beryllium Copper | 0.1 in | Tin | Solder | Glass Filled Polyphenylene Sulfide PPS |