FTR-112 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 24POS 1.27MM
| Part | Number of Rows | Operating Temperature (Max) | Operating Temperature (Min) | Termination | Insulation Material | Style | Connector Type | Shrouding | Material Flammability Rating | Pitch - Mating | Fastening Type | Insulation Height | Contact Shape | Number of Positions | Contact Length - Mating | Contact Finish - Mating | Contact Type | Contact Finish - Post | Mounting Type | Contact Finish Thickness - Mating | Insulation Color | Current Rating (Per Contact) | Row Spacing - Mating | Number of Positions Loaded | Contact Material | Features | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 24 pos | 0.205 in | Gold | Male Pin | Tin | Surface Mount | 30 µin | Black | 3.1 A | 0.1 in | All | Phosphor Bronze | ||
Samtec Inc. | 1 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 12 | 0.205 in | Gold | Male Pin | Tin | Surface Mount | 30 µin | Black | 3.1 A | All | Phosphor Bronze | Pick and Place | ||
Samtec Inc. | 1 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 12 | 0.125 in | Gold | Male Pin | Tin | Surface Mount | 30 µin | Black | 3.1 A | All | Phosphor Bronze | |||
Samtec Inc. | 2 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 24 pos | 0.43 in | Gold | Male Pin | Gold | Surface Mount | 10 µin | Black | 3.1 A | 0.1 in | All | Phosphor Bronze | Board Lock | 3 µin |
Samtec Inc. | 2 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 24 pos | 0.23 in | Tin | Male Pin | Tin | Surface Mount | Black | 3.1 A | 0.1 in | All | Phosphor Bronze | |||
Samtec Inc. | 2 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 24 pos | 0.1 in | Gold | Male Pin | Gold | Surface Mount | 10 µin | Black | 3.1 A | 0.1 in | All | Phosphor Bronze | 3 µin | |
Samtec Inc. | 2 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 24 pos | 0.285 in | Gold | Male Pin | Gold | Surface Mount | 10 µin | Black | 3.1 A | 0.1 in | All | Phosphor Bronze | Pick and Place | 3 µin |
Samtec Inc. | 1 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 12 | 0.285 in | Gold | Male Pin | Tin | Surface Mount | 10 µin | Black | 3.1 A | All | Phosphor Bronze | |||
Samtec Inc. | 1 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 12 | 0.43 in | Gold | Male Pin | Tin | Surface Mount | 30 µin | Black | 3.1 A | All | Phosphor Bronze | |||
Samtec Inc. | 2 | 125 °C | -55 °C | Solder | Liquid Crystal Polymer (LCP) | Board | Header | Unshrouded | UL94 V-0 | 0.05 in | Push-Pull | 0.1 in | Square | 24 pos | 0.23 in | Gold | Male Pin | Gold | Surface Mount | 10 µin | Black | 3.1 A | 0.1 in | All | Phosphor Bronze | 3 µin |