ESQT-146 Series

Catalog

CONN SOCKET 92POS 0.079 GOLD PCB

Part	Number of Rows	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish - Mating	Insulation Material	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Color	Contact Shape	Contact Material	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Connector Type	Pitch - Mating [x]	Pitch - Mating [x]	Termination	Insulation Height	Insulation Height	Material Flammability Rating	Fastening Type	Contact Type	Style	Current Rating (Amps)	Contact Length - Post	Contact Length - Post
Samtec Inc. ESQT-146-02-G-D-640	2	Through Hole	-55 °C	125 °C	0.079 in	2 mm	92	0.51 µm	20 µin	Gold	Gold	Liquid Crystal Polymer (LCP)	0.21 in	5.33 mm	Black	Square	Phosphor Bronze	All	3 µin	0.076 µm	Elevated Socket	0.079 in	2 mm	Solder	16.26 mm	0.64 in	UL94 V-0	Push-Pull	Forked	Board to Board Cable	4.5 A
Samtec Inc. ESQT-146-03-M-Q-368		Through Hole	-55 °C	125 °C	0.079 in	2 mm	184	0.51 µm	20 µin	Tin	Gold	Liquid Crystal Polymer (LCP)			Black	Square	Phosphor Bronze	All			Elevated Socket	0.079 in	2 mm	Solder	9.35 mm	0.368 in	UL94 V-0	Push-Pull	Forked	Board to Board Cable	4.5 A	0.09 "	2.29 mm
Samtec Inc. ESQT-146-02-G-Q-790		Through Hole	-55 °C	125 °C	0.079 in	2 mm	184	0.51 µm	20 µin	Gold	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Black	Square	Phosphor Bronze	All	3 µin	0.076 µm	Elevated Socket	0.079 in	2 mm	Solder	20.07 mm	0.79 in	UL94 V-0	Push-Pull	Forked	Board to Board Cable	4.5 A
Samtec Inc. ESQT-146-02-G-D-580	2	Through Hole	-55 °C	125 °C	0.079 in	2 mm	92	0.51 µm	20 µin	Gold	Gold	Liquid Crystal Polymer (LCP)			Black	Square	Phosphor Bronze	All	3 µin	0.076 µm	Elevated Socket	0.079 in	2 mm	Solder	14.73 mm	0.58 in	UL94 V-0	Push-Pull	Forked	Board to Board Cable	4.5 A	0.27 in	6.86 mm