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CONN IC DIP SOCKET 40POS GOLD
| Part | Housing Material | Type | Type | Type | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Features | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Material - Post [custom] | Mounting Type | Termination Post Length | Termination Post Length | Contact Material - Mating | Contact Finish - Post | Material Flammability Rating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Closed Frame Elevated | Solder | 105 ░C | -55 °C | 3 A | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | Gold | Brass | Through Hole | 3.56 mm | 0.14 in | Beryllium Copper | Gold | UL94 V-0 | 40 | 20 | 2 |